Original Design and Manufacturing(ODM)
Our ODM competence is focused on delivering a variety of integrated products & Memory Modules. Outside this domain, we operate as an Electronic Manufacturing Service (EMS) provider. For ODM, we undertake complete product development, including design and manufacturing and where there is visible value addition from us in any stage of taking the product from concept to its final shape including shipping the products to the end customers. Our uniqueness is that we have the ability to leverage our SiP technology to provide customers highly integrated and competitive microsystem solutions.
Integrated Access Device ODM
Digital Nanotech provides solutions for secure highly integrated voice and data convergence platforms for the Small Office/Home Office (SOHO), Small and Medium Business (SMB) and enterprise markets. These platforms generically are named Integrated Access Devices (IAD's) and our technology and software permit our customers to have the same or better features and functionality as do large enterprises.
Our solutions support multi-port BRI, ADSL2+, G.SHDSL, Wi-Fi & POTS. Our solutions include Session Initiated Protocol based low cost VoIP Telephony. Please Contact Us for more information.
Micro ODM
Our micro ODM business segment affords our partner customers products designed to their specifications or ours derived from our customer's commercial specification. We are extremely suited for these projects because of our SiP design and manufacturing capability. Our latest success story is a solution for a US customer, which is a Clip-on Pendant and a base station for Hospital applications.
We are developing a solution for VoIP microsystem application leveraging our multiple wireless Radio modules that include GPS, RFID, WiFi, BT & ISM.
Custom Microsystems
1) Memory Modules
Digital Nanotech manufactures DIMM Unbuffered SDRAM Memory Modules for PC in technical collaboration with SMART Modular Technologies based in Penang, Malaysia. These memory modules are manufactured in a ISO-9001 2000 certified world class plant at Hoskote near Bangalore that meets the stringent Hynix/SMART Modular manufacturing standards targeted for operation in enterprise class systems. The modules are available in multiple configurations and in densities from 256MB up to 1GB. Hynix develops the comprehensive test programs that are used on high-end functional ATE testers.
In collaboration with Hynix/SMART Modular, we have established world class quality standards for each of the processes carried out at our facility. We are the leading tier-1 memory module supplier and distributor in India reaching almost all major computer manufacturers.
2) Strategic solutions for Hi-Rel applications
The challenges facing Hi-Rel applications today are of miniaturizing the systems, to improve performance without sacrificing reliability & time. Our USP is Miniaturization of Electronic Subsystems and Systems with our System-in-a-package (SiP) implementation expertise. SiP technology specifically addresses the challenges that Aerospace and Medical Electronics industries face today by integrating dissimilar technologies like RF, Antenna, Discrete, Analog, MEMS, Digital, Memory and Power systems unlike SoC (System-on-a-chip) with benefits of low cost & high reliability.
Application Specific System in a Package (ASiP)
Business Model
ASiPs are delivered as turnkey solutions - starting from Architectural Concept to Design to Prototyping, Qualification & Final Production. All turnkey solutions are application specific and customer driven. We undertake complete architectural responsibility for co-designing the solution leveraging our ASIC, System Design and SiP Technology strengths to optimize customer needs
We engage customers at critical milestone sign-offs to ensure minimal design changes and also to ensure first time success. Our commercial package would include both development and production costs. We will work with customers and create an attractive commercial package optimized for the required form-factor, performance at the least possible investment for a mutually beneficial business relationship.
Technology
Substrate Engineering - This involves selection of appropriate substrates like FR-4, BT, Alumina, Ceramic, IMC, DBC, etc. depending on the technology and cost requirements of the final solution. We have in house technology and library for embedding passives, varieties of filters, etc. primarily for RF designs. However, we outsource the LTCC manufacturing to vendors like Kyocera, Anaren, etc.
ASIC & FPGA design is done using traditional methods and are mostly digital. The primary objective is to meet customers' integration, cost, and time-to-market needs. SiP technology allows freedom from long drawn ASIC design cycles. The combined methodology of using ASIC design and standard components through value added system engineering provides the most optimal solution.
Tools - Our design team has thorough knowledge of the complete design methodology of SiP implementation and has the required amount of exposure with the whole range of software tools. For ASIC design, we follow the standard Cadence, Synopsys or Magma tool flow. For PCB design, SI/EM analysis, we use Cadence's Allegro and Sigrity's SpeedXP respectively. For Package layout, we use Sigrity's UPD and for RF design and SI/EM analysis, we use AWR and Sigrity's SpeedXP respectively. For thermal analysis, we have expertise in using Optimal, Icepack tool sets. Our hardware lab is equipped for advanced antenna and RF microsystem design.
Digital Nano Tech has built streamlined project management teams with risk mitigation, exceptional design capabilities, strong vendor development skills, etc.
1. Design Methodology:
Digital Nano Tech follows the Industry Standard design methodology for successful delivery of critical programs to customers. The reliability is "designed in" by using FEM techniques at chip level, package level, and process level.
2. Design Team:
Digital Nano Tech has established design teams with over a decade of experience in Defense, Aerospace & Medical Electronics, who are well versed with the industry standard tools and related processes.
a) System Design - Multi technologies: Mixed Signal, Analog & Digital
b) VLSI & ASIC design
c) Thermal, Cross Talk, Signal Integrity & Reliability design
d) MIL / Aerospace Standards
e) SiP implementation & Advanced Packaging design
f) RF & Antenna design
3. Packaging:
Digital Nano Tech has in-house advanced package design capability. We use Ceramic and Plastic Packaging Technologies & Pre-molded technologies including PGA, LCC, BGA, CSP, LTCC, PBGA, Stacked Die, QFN, SDIO, USB, etc.
4. Testing:
Digital Nano Tech places a lot of emphasis on first time success of its solutions with very high first pass yield output. Extensive simulation is carried out during the design process before design actualization of the intended solution. The quest for perfection in the design stage is complemented by extensive test facility in the Digital Nano Tech production floor for the products coming out of the manufacturing line that has been aligned with the rest of the process to yield products that pass 100% of the test vectors.
Digital Nano Tech's testing philosophy encompasses functional, parametric and post assembly Go/No-Go inspections. Functional testing is done with the help of custom test benches depending on the product to be tested. For parametric testing, industry standard test sets are employed and for post assembly inspection, advanced optical, X-ray technology based instruments are used apart from the standard techniques like Bed of Nails, ICT (In-Circuit Testing), etc. The testing methodology employed at Digital Nano Tech is capable of handling JTAG based testing.
Digital Nano Tech has relationships with third-party houses for functional test, MIL and Rad-hard qualification.
Manufacturing Infrastructure
Digital Nano Tech has a captive state-of-the-art fully automated chip level assembly line which includes precision and highly flexible die bonders to handle wide variety of base structures (ceramic, laminate or lead frame), fast and precision wire bonders with full flexibility to h
We can handle the special needs of stacked die approach (Au, Al and Cu wires/ribbons), flip chip handling options, ball-attach and micro-BGA assembly line, molding and hermetic packaging line, etc. The process parameters in the manufacturing line are evolved carefully through continuous line and process qualification procedures and these data form the strict guidelines at the design stage.
For more Information, Contact Us.